When packaged, the freshly sawn (or ‘singulated’) die will be glued to a lead frame (a metallic scaffold) before gold (or copper, lately) bond wires are attached between this leadframe and the ...

Intel's Malaysia facilities don't include a wafer fabrication plant ... Each die is tested by connecting it to a probe card which contains thousands of needles thinner than a human hair.

This requires a very large memory subsystem known as the Catch RAM to store a bit image of all ... of contacts. The wafer prober lifts the wafer into contact with the probe card.

Increased performance requirements at probe may mean that the traditional generic tester-to-probe card interface specification must change. With a generic wafer-test interface, the tester ...