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Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test - IEEE Xplore
The die-attach layer is a vulnerable structure that is important to the reliability of an insulated-gate bipolar transistor (IGBT) module. A new failure mechanism named fatigue crack network (FCN) has ...
Published in: 2023 IEEE 11th Asia-Pacific Conference on Antennas and Propagation (APCAP) Date of Conference: 22-24 November 2023 Date Added to IEEE Xplore: 21 March 2024 ISBN Information: DOI: 10.1109 ...
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