Power Integrations added a wide-creepage package option to its InnoSwitch3-AQ flyback switcher IC for automotive applications: A wide drain-to-source-pin creepage distance of 5.1 mm eliminates the ...

Michael Walsh (all posts) Michael Walsh is the Technical Director for IC Packaging Solutions at Siemens EDA, where he has worked in various Application Engineering roles since 1992. Walsh has worked ...

Research into using glass substrates for chipmaking is nothing new. As Intel’s release says, the company has been working on this technology for at least a decade, as have other organizations ...