The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D ... Each of these interconnect structures are used for a particular package type. And each one has a number ...

Die cracking, solder joint fatigue, warpage, and delamination are just a few of the possible mechanical failures.

Privately held EDA firm Sigrity is offering a new tool called CoDesign Studio that analyzes power across the IC and package. Prior to this release ... “Users can also try different packages with their ...

Thermal management protocols offer different approaches to regulate and control temperature during IC package testing, and the approaches vary in accuracy, stability, temperature range ...

The key to such technology is to use both internal and external cooling circulation systems to work together in a single IC package ... of product solutions for different application scenarios ...

Mentor Graphics is bringing together the IC design, package design and PCB layout in a single tool environment. The design environment called Xpedition Package Integrator flow can be used to integrate ...

Incorporating both a photodiode and a signal processing circuit, the EIC-3200 series of photo IC sensors is said to be the first such device to be housed in a surface-mount package. The sensorÕs ...