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Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed ...
In fact, IC package design in conjunction with chip design remains a huge problem with few automated solutions. Many chip designers rely on spreadsheets for optimization decisions. And, the ...
A new generation of integration automation software combined with interconnect IP supports faster time-to-silicon for ...
The resulting workflow is part PADK and part traditional packaging software design flow. See figure 2 below for an example OSAT focused process flow with a similar flow that can also be performed by ...
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Zacks Investment Research on MSNHere's How Much You'd Have If You Invested $1000 in Cadence Design Systems a Decade AgoFor most investors, how much a stock's price changes over time is important. Not only can it impact your investment portfolio, but it can also help you compare investment results across sectors and ...
Presto is adopting the Cadence ® system design and analysis portfolio for advanced IC packaging, which includes the Cadence Allegro ® Package Designer Plus, Clarity™ 3D Solver, Sigrity™ XtractIM™ ...
Image Credit: Stas Knop/Shutterstock.com A Brief Introduction to Semiconductor/IC Packaging IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or ...
A recently developed software tool automatically checks for design-rule violations as locations are designated for wire bonds between die and package lead frames. Known as the Post-Layout Bond ...
An example of a highly integrated gate driver is the MPQ6533, a 3-channel gate driver IC with integrated features like slew rate control and internal diagnostic functions. This device is available in ...
First is the NeoGene Liquid Cooler which will be used for packaged IC heat dissipation at 1 U configuration. The second is the Direct-to-Silicon Cooling Package Module, which can be adopted by IC ...
Most IC design houses are generally uncertain about the prospects for the second half of 2023, as many end-market brand vendors and channel operators of consumer electronics products have ...
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