Siemens is a founding partner of the Intel Foundry Accelerator Chiplet Alliance – enabling a new and compelling  solution for ...

A friend recently sent me an email noting that the classic 2N3904 bipolar transistor was now 60 years old. Since its “birth” ...

Siemens Digital Industries Software today announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated foundry reference flows, and additional ...

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design ... while enabling global resource optimization, chip-package co-design and advanced multiphysics convergence analysis ...

EDA software is revolutionizing high-speed digital design by accelerating time-to-market despite growing complexity.

CDNS expands its collaboration with TSMC to accelerate time to silicon for advanced-node and 3D-IC technologies.

The Si-Fly cable assembly from Samtec lets you mount connectors to a board while going under cooling components. High-speed ...

Cadence today announced it is furthering its longstanding collaboration with TSMC to accelerate time to silicon for 3D-IC and advanced-node technologies through certified design flows, silicon-proven ...

The Cadence Integrity™ 3D-IC Platform now features enhanced support ... while enabling global resource optimization, chip-package co-design and advanced multiphysics convergence analysis across ...