That feature no doubt came as a result of what was probably the overriding design goal: cheap, rapid manufacturing methods. Inside the DIP package, the IC die itself is mounted to a metal assembly ...

Modern package and interposer design has become a system integration task: designers have the responsibility to take input from various stake-holders – who are often designing their content at the ...

Hierarchical planning and parameterised pin region strategies form a smart path to designing chiplets, explains Heiko Dudek.

These system-in-package devices present many design challenges as ... demands a unified workflow that can model and analyze all aspects of the design together, as one system. IC hyperconvergence is ...

Power Integrations added a wide-creepage package option to its InnoSwitch3-AQ flyback switcher IC for automotive applications ... years of his career helping design microprocessors, embedded ...

Fig.2. Failure analysis methodologies used in IC development (a) (b) [1] JCH Phang, DSH Chan, M. Palaniappan, JM Chin, B. Davis, M Bruce, “A review of Laser Induced Techniques for Microelectronic ...

VSOP383xx series of preamplifier circuits for IR remote control applications in consumer products with the new Cyllene 2 IC. Offered in the 2mm x 2mm x 0.76mm QFN package, the improved solutions ...

The IC supplies the flexibility to function as either a single-channel H-bridge or two half-bridge channels gate driver. When paired with an external MOSFET, it can replace mechanical relays, ...