First, the company’s Innovator3D IC suite enables chip designers to efficiently author, simulate, and manage heterogeneously ...

A critical breakpoint is the intersection of the package design activities and assumptions with those of the silicon design process. Leveraging both our experience in wire-bonded IC/package co-design ...

These physical design reuse circuits (PhRC) are native, first-class design objects that provide dynamic net propagation from the parent netlist, allow for rapid ECOs, and manage the golden source of ...

The Innovator3D IC solution suite has been developed to enable IC designers to author, simulate and manage heterogeneously ...

Siemens Digital Industries Software today introduced two new solutions to its Electronic Design Automation (EDA) portfolio ...

IC package design best practices. In order to efficiently design new types of IC packages, designers and design teams need to embrace a new emerging set of best practice design techniques, processes ...

Two software tools, Innovator3D IC and Calibre 3DStress, address chiplet integration and thermal management at the transistor ...

The design environment called Xpedition Package Integrator flow can be used to integrate existing IC, package and PCB design tools from Mentor and even third party tools. According to Mentor, the ...

EPEPS -- Cadence Design Systems, Inc. , a leader in global electronic design innovation, today announced enhancements to its Allegro® 16.6 Package Designer and System-in-Package Layout solution ...

Collaboration Provides Insight on IC Packaging Trends and Delivery of State-of-the-Art IC Package Design Services. MEYREUIL, France& SAN JOSE, Calif.---- Presto Engineering, an ASIC design and ...