Micron is well-positioned to benefit from this trend, with its advanced HBM3E and newly shipped HBM4 products offering ...

ASE’s FOCoS-Bridge with TSV can fulfill next-generation AI and HPC performance demands through heterogenous integration for high-power and high-bandwidth systems.

JEDEC has published the official HBM4 (High Bandwidth Memory 4) specification under JESD238, a new memory standard aimed at keeping up with the rapidly growing requirements of AI workloads, high ...

High Bandwidth Memory (HBM) stands as one of the crucial components driving AI performance. Through the adoption of the HBM4 JEDEC Standard, this technology promises to deliver even higher ...

3D X-DRAM technology will bring bigger, faster memory by ... NEO’s 3D X-DRAM stacks layers sky-high, ... NEO’s statements about eliminating the need for TSV and enabling up to 32K-bit bus ...

The memory-chip maker reports revenue of $9.3 billion for the fiscal third quarter on strong demand for its high-bandwidth memory chips Last Updated: June 25, 2025 at 9:08 p.m. ET First Published ...

Generative AI has sparked significant demand for Micron’s advanced memory products. Competitive pressures facilitate opportunities on both sides of Direxion’s MU-focused bull and bear funds ...

Micron’s high-bandwidth memory (HBM) business stood out, with sales of $1.5 billion marking nearly 50% sequential growth, fueled by demand for AI computing applications.

Report: 2027 iPhones Could Adopt Advanced AI Memory Technology. Wednesday May 14, 2025 4:35 am PDT by Tim Hardwick. ... they said it's high bandwidth, memory, not High Bandwidth Memory) ...

SK Hynix's stock rose as much as 4.8% to 260,000 won, equivalent to $191.26, early Tuesday and changed hands at more than 250,000 won for most of the session, beating its previous record intraday ...

SUNNYVALE, Calif., May 28, 2025--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced Fan-Out Chip-on-Substrate ...