Lam Research remains a dominant force in semiconductor equipment despite short-term trade and valuation risks. The company’s ...

Micron is well-positioned to benefit from this trend, with its advanced HBM3E and newly shipped HBM4 products offering ...

High-bandwidth memory (HBM) offers breakthrough memory bandwidth through its vertically stacked memory architecture and through-silicon via (TSV)-based fast interconnect. However, the stacked ...

In this paper, we present a novel approach to optimize the through-silicon vias (TSV) structure by the multi-conductor transmission line (MTL) theory and a genetic algorithm (GA) for high bandwidth ...