High Bandwidth Memory (HBM) is a high-performance 3D-stacked DRAM. It is a technology which stacks up DRAM chips (memory die) vertically on a high speed logic layer which are connected by vertical ...
"TSV is a technology that enables high capacity, high bandwidth by drilling microscopic ... SK hynix is currently leading the AI memory market, offering fifth-generation HBM3E products.
Designed for systems that require low latency and high bandwidth memory, the Rambus HBM PHY, built on the GLOBALFOUNDRIES advanced 14nm Power Plus (LPP) process technology, is targeted at networking ...
An executive of SK hynix said Thursday the firm will cooperate with Advanced Micro Devices (AMD) of the United States to supply highly-advanced chips for data-intensive mobile devices.
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New Delhi, Jan. 31, 2025 (GLOBE NEWSWIRE) -- The global high bandwidth memory market was valued at US$ 501.0 million in 2024 and is expected to reach US$ 5,810.5 million by 2033, at a CAGR of 31.3 ...