Apple is reportedly planning to equip the 2026 models with a high-capacity six-channel LPDDR5X memory configuration, significantly upping the memory bandwidth for future AI features and multitasking.

Samsung Electronics is cutting production of mature-node DDR4 memory and reportedly scaling back its third-generation high-bandwidth memory (HBM2E) business to focus resources on fifth-generation ...

TL;DR: SK hynix unveiled next-gen HBM4 memory ... bandwidth, targeting NVIDIA’s Vera Rubin AI GPUs in 2026. Mass production begins in late 2025, featuring advanced MR-MUF and TSV tech for high ...

Samsung Electronics’ memory chip profit backpedaled in the first quarter following the U.S. ban on exporting high-bandwidth memory (HBM) for artificial intelligence (AI) accelerators to China.

HBM (High Bandwidth Memory) is a JEDEC industry standard, to which proteanTecs contributes, and a critical enabler to the surge of AI applications for high performance computation. HBM subsystems are ...

While other DRAM makers can still offer comparable products, the longer-term trend is clear: industry giants are pivoting resources toward DDR5 and high-bandwidth memory (HBM), transforming what ...

Samsung Electronics and SK hynix are considering the introduction of hybrid bonding technology to the next-generation high bandwidth memory (HBM) stacking method, leading to anticipated shifts in ...

on erosion in average selling price as well as a drop in sales of its key high-bandwidth memory (HBM) chips due to export controls, according to a company statement. Some clients also deferred ...

To back this up, Intel is also rolling out some advanced packaging solutions, including EMIB-T, which is designed to handle the high bandwidth memory needs of future chips. With two new versions ...

March-quarter operating profit at Samsung’s chip segment tumbled to 1.1 trillion won (US$770 million) on erosion in average selling price, as well as a drop in sales of its key high-bandwidth memory ...