News

Generative AI is arguably the most complex application that humankind has ever created, and the math behind it is incredibly ...
NEO Semiconductor, a leading developer of breakthrough memory technologies, today introduced the world's first Extreme High Bandwidth Memory (X-HBM) architecture for AI chips. Built to meet the ...
Teradyne launches Magnum 7H, designed to test high bandwidth memory devices integrated with GPUs and accelerators for ...
SK hynix tops Samsung Electronics as the world's biggest memory chip supplier for the first time ever in Q2 2025, thanks to ...
Demand for high-bandwidth memory (HBM) in AI and strategic inventory building driving up DRAM prices. Micron's position as ...
SK Hynix overtook Samsung Electronics in global memory chip revenue for the first time in the second quarter of 2025, powered ...
The tester helps check memory chips faster and better. It could be important for making AI and cloud devices work well at large scale.
SK hynix has claimed the top spot in the global memory chip market for the first time, overtaking long-time leader Samsung ...
ChangXin’s AI pivot chokes supply The price of standard DDR4 DRAM has gone through the roof, with 8-gigabit units hitting ...
Micron's stock faced a pullback after a cautious report on memory growth. Explore why HBM and DRAM trends still signal potential upside.
Samsung is no longer the top memory maker as its rival SK Hynix takes the lead. It accounts for 33.5% market share, compared ...
Leading semiconductor companies voiced strong support for open chiplet standards at the OCP APAC Summit 2025 in Taipei, ...