NVIDIA is considering moving to CoWoP advanced packaging for its next-gen Rubin GPUs: removes substrate, connects interposer ...

Zettabyte, a fast-growing innovator in AI data center infrastructure software, today jointly announced a new strategic investment by Lam Capital, the corporate venture arm of Lam Research Corp., a ...

Nvidia placed orders for 300,000 H20 chipsets with contract manufacturer TSMC last week, two sources said, with one of them ...

TSMC's first generation of SoW packaging involved mounting just the processing dies to the wafer, whereas the new version ...

The AMD Ryzen 7 9700F has generated interest as AMD’s first Zen5 processor that does away with onboard graphics. Priced at roughly $220, it undercuts the Ryzen 7  9700X in the current AM5 lineup.

What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

Sandisk has appointed two leading figures in computing to help shape the direction of its high-capacity memory tech for AI ...

Nvidia has asked Chinese companies interested in purchasing Nvidia H20 chips to submit new documentation including order ...

Every chip found in any electronic device - such as a robot - is likely to contain a metalloid, the most common being Silicon ...

Nvidia placed orders for 300,000 H20 chipsets with contract manufacturer Taiwan Semiconductor Manufacturing Co. (TSMC) last week, two sources said, with one of them adding that strong Chinese demand ...