eaglei 200 is available for 2" to 200mm wafer cassette & carrier inspection and eaglei 300 for automated 300mm foup and fosb wafer carrier inspection. represents the union of two industry-leading ...

As of 2018, the FOUP segment's share exceeded 60% of the total market. FOSB wafer carrier cassettes are used for the safe transportation of 300mm wafers as they preserve material purity and ...

The F300 AutoPod that uses the polymer comes from Entegris Inc., Chaska, Minn. The Foup combines a wafer carrier and a pod in a single enclosure. Its carrier holds 25 wafers and the pod is ...

FOUP carriers are expected to be widely used in 300-mm wafer fabs to protect and transport the large-diameter substrates between tools. “Front opening substrate carrier technology has now been ...

The new FOUP load port improves performance with new servo-controlled motion, a smart latchkey design and optimized carrier sensing systems, Asyst said. Tool throughput has been enhanced, with the ...

The base station for the 300 mm Integrated Wafer is built into a front opening unified pod (FOUP) and the 200 mm base station is located within a standard wafer cassette. By integrating the ...

SAN FRANCISCO, CA--(Marketwired - Jul 7, 2014) - SEMICON West --Roth & Rau - Ortner, a specialist in optimizing production flows in complex manufacturing environments, today introduced the FOUP ...

Dublin, Nov. 28, 2024 (GLOBE NEWSWIRE) -- The "Semiconductor Wafer Carrier for Thin Wafer Market by Product Type, Application, End-Use Industry, Material Type, Carrier Technique, Manufacturing ...

Gudeng Precision Industrial has obtained front opening unified pod (FOUP) orders from a number of 12-inch foundries including United Semiconductor (Xiamen), Huali Microelectronics (HLMC ...