The Mold-man 8000 can replace epoxy-potting operations for sealing and encapsulating electronic components. Operating at injection pressures as low as 15 psi or as high as 450 psi, the Mold-man can ...

Structalit 8801 is a single-component adhesive based on epoxy resin. Due to its viscosity characteristics it is perfectly suited as a potting or filling material. The beige-coloured adhesive possesses ...

A new flexible, tough epoxy potting and encapsulation compound called EP30FL can be used in both thick and thin cross sections. It is 100% reactive and contains no volatiles.

H.B. Fuller's FH1438AB potting compound is a two-part epoxy resin system. This highly flexible material with a durometer value of 70 Shore 00 provides the required protection to surface mount ...

Epoxy potting, seismic, water, moisture, dust, long term stable and reliable quality. Over voltage, over current, over temperature, short circuit, it can be auto protection, and can work in normal ...

The new Polytec PT brochure from Intertronics offers information on specialist epoxy resin adhesives and potting compounds for electronics, electrical engineering, optical and medical industries. It ...

Shenzhen, China, June 07, 2024 (GLOBE NEWSWIRE) -- Shenzhen Deepmaterial Technologies Co., Ltd, a pioneer in the field of electronic protection solutions, announces its latest advancements in ...