As TSMC does not need High-NA EUV tools for N2 and N2P, it will not need them for A16 either. By contrast, A14 is an all-new node that will be used for mass production in 2028, ...

TSMC reportedly still won't use new High-NA EUV lithography machines for its next-gen A14 (1.4nm) process node, will rely on old semiconductor equipment.

At the NA Technology Symposium, TSMC SVP Kevin Zhang admitted that the firm will skip high-NA tools for its A14 node, instead sticking to tried and tested 0.33-NA EUV.

TSMC has revealed its High-NA EUV lithography machine roadmap: next-gen A14 process node in Q3 2027, A14P process node arrives in 2028. News. All News AI Business, ...

TSMC was expected to receive its first high numerical aperture (high-NA) extreme ultraviolet (EUV) lithography system, the "EXE:5000," from Dutch manufacturer ASML in September 2024, according to ...

TSMC has made a production roadmap for using high-NA EUV lithography equipment to make 1.4nm chips starting as early as 2028, according to industry sources.

Speaking at a press event, TSMC senior vice president Kevin Zhang [pictured] said the chipmaker still hasn’t found a compelling reason to pay up for ASML’s near €370 million monster.“A14 ...

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Chipmaker TSMC is expected to receive the first shipment of High Numerical Aperture NA Extreme Ultraviolet (High NA EUV) lithography machines from ASML before the end of the year. According to a ...

More than half of TSMC's revenues came from its smallest 5nm and 3nm nodes during the quarter, but it will reportedly stick with its existing low-NA EUV systems for its upcoming 2nm and 1.6nm nodes.

ASML's largest customer, TSMC, uses those EUV systems to manufacture top-tier chips for fabless chipmakers like Apple, AMD, Nvidia, and Qualcomm. Two silicon wafers. Image source: Getty Images.