But damage to a particular die on a wafer can be remedied only by designating ... trace that shows some horizontal as well as vertical movement. A bent probe tip will scratch the wafer surface as it ...

Dice being singulated with a diamond saw The general plan is to use testing at a variety of points to improve overall quality, by weeding out bad wafers (PCM data) bad die (wafer probe ...

Two key trends are converging on wafer probe, leading the need to rethink ... solutions where multiple known-good die (KGD) are mounted in a single package. Examples of modern MCPs include mixed ...

Experts at the table, part 3: Analog/mixed signal test is still only partly baked; what happens with stacked die; the return of wafer probe. Semiconductor Engineering sat down to discuss current and ...

FormFactor Inc. has developed a family of advanced wafer probe cards designed to address the rising cost ... bond logic and SoC manufacturers need to lower their test cost per die and support their ...

The introduction of the double-sided wafer probe test cell is expected to have ... this solution addresses the critical need for known good die testing before wafers are diced and packaged into ...