Wafer dicing is a crucial step in the semiconductor industry, particularly with blade sawing leading to small PPM (Parts Per Million) of chip and crack defects. This issue is intensified in Wafer ...

Wafer dicing is a crucial first step in semiconductor manufacturing that directly affects the package quality and performance of the devices and modules, therefore, it has a wide range of application ...

In the semiconductor space, laser technology is increasingly utilized for tasks such as marking, dicing, and scribing.These solutions, integrating lasers spanning from ultraviolet to far-infrared ...