According to Diamfab’s Chicot, one of the key advantages to synthetic diamond materials is its ability to withstand very high voltage due to its physical properties. Chicot said the material is 30 ...
As industry players collaborate and invest in research, continuous improvements in diamond wafer processing are expected to reduce production costs and boost efficiency. This dynamic market ...
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Ultra-thin diamond wafers for electronics made using sticky tapeA new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has ...
Chip binning' is supposed to be the process of testing newly manufactured silicon to see how many of the important bits work and how high the thing will clock. But TSMC seems to be taking the notion a ...
An alternative synthesis method is chemical vapour deposition (CVD), which offers the potential to grow exceptionally pure diamond on a wafer scale. It also enables precision ‘doping’ with ...
As industry players collaborate and invest in research, continuous improvements in diamond wafer processing are expected to reduce production costs and boost efficiency. This dynamic market ...
Still, it's a good opportunity to speculate over the best way a keen enthusiast might try to cut the wafer into individual chips. Diamond tipped pizza slicers are the obvious choice. That said ...
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