Abstract: In this study, the first 3D direct integration of a SiC power MOSFET and its SiC CMOS gate driver is achieved using flip chip bonding, enabling a wire bondless connection. Switching ...
Development of High Density 3D NAND Flash Memory Using New Scaling Technologies for AI Semiconductor
Abstract: Scaling technology of 3D NAND flash is recently required to implement large-capacity memory and high performance due to recent demand of AI semiconductors. However, it is suffering from the ...
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