We recently published a list of Top 11 AI News and Ratings You Should Take a Look At. In this article, we are going to take a look at where Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM ...

When we first started The Next Platform a decade ago, there was not really much of a reason to cover the company’s datacenter ...

The global political and economic landscape is characterized by volatility; nevertheless, sources within the semiconductor ...

Despite risks like geopolitical tensions and high capital expenses, TSMC's long-term vision and market leadership make it a ...

HTC Corp (宏達電), which supplies VIVE virtual-reality (VR) headsets, yesterday said that Google LLC has agreed to buy its extended reality (XR) intellectual property (IP) and acquire some of its ...

Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.

Nvidia has so far relied mainly on one type of CoWoS technology, CoWoS-S, to combine its AI chips. Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it ...

Nvidia CEO Says Its Advanced Packaging Technology Needs are Changing: Summary Nvidia CEO Jensen Huang confirmed the company's strong demand for TSMC's advanced packaging, transiti ...

TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims ...

During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system has now fully entered production, which will gradually enhance CoWoS-L ...