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Qualcomm's new chip packaging deal with UMC could upset TSMCAfter all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good design. Chip packaging technology is one of the main keys, and TSMC also ...
Silicon Laboratories has been awarded a grant of $23 million under the Texas Semiconductor Innovation Fund (TSIF). The ...
From there, researchers work backward in order to package all the resulting pieces ... our reliance on existing templates or form factors for chip design is quite limiting. And even with these ...
Rigorous testing is still required, but an abstraction layer can significantly reduce errors in the fab while optimizing ...
An curved arrow pointing right. The modern chip bag took decades to evolve from a single sheet to a complicated mix of plastics and aluminum. The design, referred to as a multilayered package, is ...
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Cadence says its AI-driven chip design tools provide a process node's worth of performance gain, but without moving forward to a new nodeAnirudh Devgan, the CEO of Cadence, recently remarked that the company's AI-assisted chip design tools enable chip ... verification, PCB and package and system analysis, it is a pretty rich ...
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