The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging ...

These cores are arranged together on a die, sliced from a wafer of silicon-based semiconductor material. Before we get into specific CPU recommendations, let's build an understanding of what ...

TSMC’s InFO design with the DRAM stacked on top of the CPU package | TrendForce The Kirin 9020 appears to have been using a wafer integration system similar to Apple’s, packaging the chip on a single ...

Apple's M3 chips successfully brought all-new performance levels but quickly became problematic, leading to the shortest lifespan of any microchip in Apple history.

A recent analysis sheds light on the increasing wafer prices and the ... its significantly more powerful CPU, GPU, and neural cores. Got a detailed price/die/density analysis of Apple A-silicon ...

To the right of the CPU section is the I/O die consisting largely of PCIe interfaces. Above this and the CPU tile is the SoC die. This includes features such as the memory interface, the NPU for ...

The race is on to implement wafer stacking and die-to-wafer hybrid bonding ... bringing memory closer together with the CPU and the GPU, said Alex Smith, executive director of global business ...

As a reminder, 3D V-Cache is AMD's system of stacking a secondary silicon wafer consisting solely ... chip/s that make up the rest of the CPU. This extra die more than doubles the L3 cache of ...

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...