Lam Research benefits from the rise in AI-driven chip demand. Read why LRCX stock is a solid buy for long-term investors ...

AMD's new flagship Ryzen 9 9950X3D processor has 16C/32T at up to 5.7GHz, with two CCDs and a single IO die. This is the same ... they received a fake CPU in a sealed box that ended up being ...

Sandisk has unveiled High Bandwidth Flash (HBF) for AI workloads which will have a major impact on the $100 billion HBM market.

According to a slide that Sandisk shared, HBF combines BiCS technology with CBA wafer bonding ... interfacing with a logic die and PHY, which then connects to a GPU, CPU, TPU, or SoC die.

That said, the Radeon RX 7900 XTX's memory bandwidth (384-bit/960GBps) and memory capacity (24GB) are undeniable advantages.

According to a slide that Sandisk shared, HBF combines BiCS technology with CBA wafer bonding ... interfacing with a logic die and PHY, which then connects to a GPU, CPU, TPU, or SoC die.

If you scale up, say, a cortex-m0 core to the size of a modern CPU, you're going to get jack shit performance for the same price, i.e. die area ... nodes where the wafer has a repeating sequence ...

and that’s what it would have to use to create a larger GPU die, as well. If AMD were cutting larger graphics chips out of these wafers, yields would be lower, as the silicon wafer wouldn’t be ...

Aehr Test Systems Inc. (NASDAQ:AEHR) provides advanced solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form. The company ...