The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging ...

Problems and solutions for improving performance with more data. Demand for new and better AI models is creating an ...

Because wafer diameter details weren’t explicitly mentioned, it’s assumed that TSMC is using its standard 300 mm substrates. At these nodes, the die area per chip is so small that the number ...

This collaboration aims to provide comprehensive long-term storage solutions for semiconductors, including die and wafer banking, to meet the evolving needs of the electronics manufacturing industry.

Sen. Joni Ernst, an Iowa Republican facing reelection in 2026, flippantly dismissed voters’ concerns in recent days that people could die if Republicans cut Medicaid as they’ve promised to do ...

That's a different AI-crunching implementation than we've seen to date, with the laptop relying on discrete silicon instead of a GPU or a neural processor on the CPU die for machine learning tasks.

As with the raft of Intel CPU updates issued at the end of 2024, this one again addresses Vmin Shift Instability, where the CPU voltage can fluctuate to unsafe levels, despite Intel saying it had ...

Advanced AI/CPU processors demand extreme high frequency and power performance from SLT and ATE test sockets. These sockets are in the critical path at the end of a very costly silicon fabrication and ...

With the Nintendo Switch 2 entering development as early as 2019, it might not come as a surprise that the hardware chip may have been finalised as early as 2021. And according to a teardown of a ...

Dell’s new flagship 18-inch mobile workstation is the first to use Qualcomm's memory-rich AI-100 inference card. I witnessed it cooking on AI tasks without breaking a sweat. Computers are my ...