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TSMC's next generation of system-on-wafer packaging will make today's CPUs and GPUs look pathetically feeble in comparison
That last aspect is set to take a gargantuan leap forward thanks to the world's top chip manufacturer and its next generation ...
TweakTown1d
NVIDIA explores CoWoP (Chip-on-Wafer-on-Platform) PCB packaging with next-gen Rubin GR150 GPUs
NVIDIA is considering moving to CoWoP advanced packaging for its next-gen Rubin GPUs: removes substrate, connects interposer ...