According to a slide that Sandisk shared, HBF combines BiCS technology with CBA wafer bonding ... interfacing with a logic ...

Take, for example, a Raptor Lake CPU die fresh off the wafer at Intel's fab facility in Israel. The max configuration for Raptor Lake is in an 8+16 (P-cores and E-cores), which means only the ...

This silicon wafer undergoes a sequence of intricate ... its Zen architecture with the launch of the single-die Ryzen desktop CPU. Just a few months later, AMD debuted two multi-chip product ...

Intel Ice Lake-SP 28-core die shot. Source ... found on a sticker on the outside of the wafer carrier, but we don't know what core architecture this CPU is using. The Raptor Lake-S CPUs that ...

The race is on to implement wafer stacking and die-to-wafer hybrid bonding ... bringing memory closer together with the CPU and the GPU, said Alex Smith, executive director of global business ...

But inevitably, the work you need to do goes beyond what a single wafer’s worth of cores can deliver ... dynamics simulation from Tri-Labs was also run on the “Quartz” CPU-only cluster at Lawrence ...

AMD shows off its first 2nm-class Venice CPU die built using TSMC's N2 node Venice, built on Zen 6, targets high-performance computing workloads AMD and TSMC hope to deepen their collaboration for ...

As a reminder, 3D V-Cache is AMD's system of stacking a secondary silicon wafer consisting solely ... chip/s that make up the rest of the CPU. This extra die more than doubles the L3 cache of ...

Enthusiasts understand what a CPU is and what it does ... nodes TSMC takes 'chip binning' to a whole new level as entire wafer 'found in a dumpster' Broadcom and Nvidia are claimed to be testing ...

A recent analysis sheds light on the increasing wafer prices and the ... its significantly more powerful CPU, GPU, and neural cores. Got a detailed price/die/density analysis of Apple A-silicon ...