Product security and reliability are major concerns in the semiconductor and PCB fabrication industries. Because of this, ...

This remains a key research area in material sciences, with researchers working to develop and evaluate theoretical models of crack growth behavior at the nanoscale. The scanning electron microscope ...

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Explore news and insights on climate change, environment policies, global warming and sustainable practices with The New York Times Climate and Environment section.

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This paper investigates substrate trace crack in board level Power Thermal Cycling (PTC) test with underfill between package and PCB. Effect of underfill is evaluated by comparing substrate material ...

Discover the best R&D software tools to boost your project efficiency and drive innovation in your research development processes.