A new kind of processor that uses microwaves can be used in future AI systems or in wireless communications, a new study ...
SK hynix's rumored HBS (High Bandwidth Storage) uses stacked mobile DRAM and NAND chips into a single package, for next-gen ...
Parade Technologies Samples World’s First eDP TTED for Automotive Cockpit Displays; New TC1316V simplifies design and reduces cost ...
From satellites to deep space probes, missions increasingly depend on onboard AI/ML to analyze data, detect anomalies, and ...
Leading HBM device makers and foundries must simultaneously handle multi-layer chip stacking, die warpage, and shorter ...
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Mining's digital transformation integrates algorithms and sensors, enhancing efficiency and safety across operations with ...