Abstract: Measurements of temperature histories of epoxy/glass prepreg layers during multilayer printed wiring board lamination have been recently obtained. It is shown that the temperature histories ...

However, silicon and glass have very low coefficient of thermal expansion (CTE), 3-8 ppm/°C, compared with organic printed wiring board (PWB), which has a CTE of 12-18 ppm/°C. The large CTE mismatch ...