Taiwan Semiconductor Manufacturing Co. (TSMC) plans to start using 450-millimeter wafers to build its processors in 2018, following delays in the development of ...

As the semiconductor industry debates the merits and drawbacks of a possible future move to 450mm wafers, a movement has emerged to significantly enhance and extend the 300mm wafer size generation.

Multiple members of the G450C -- an organization devoted to researching and commercializing 450mm wafer technology -- have declared their intent to exit the program. 450mm wafers have been on life ...

Intel's experimental D1X foundry is starting its 450mm wafer ramp. The new wafer sizes could substantially lower costs per chip, but the upfront CapEx will be substantial.

Intel, Samsung, and TSMC will collaborate on 450mm silicon wafers; once chip companies have made the move, users should start to see higher-performing chips at lower prices ...

Back in May, Intel partnered with TSMC and Samsung to announce their intention of developing and deploying 450mm wafer starts by 2012. The shift from 300mm (12' diameter wafers) to 450mm was ...

A 300mm wafer is about the size of a dinner plate. A 450mm wafer, the size of an extra-large pizza, can hold twice as many die (the die are the individual chips.) ...

Chip makers Intel, Samsung and TSMC have agreed to make sure an infrastructure is ready to support the development of 450mm wafers for testing by 2012 and for production by 2014.

The semiconductor industry is moving to 450mm wafer sizes in the next few years, and semiconductor equipment manufacturers need to position themselves now to reap the benefits. The best way is to ...

In a nutshell, the 450mm transition is about yields, and how this works is pretty straightforward. The picture below shows a standard 300mm wafer, which is the basic unit of semiconductor production.

Spike annealing system to be used in development of 450mm semiconductor wafer manufacturing process. The semiconductor industry’s “Global 450-mm Consortium” (G450C) has selected US-based Ultratech’s ...

The first D1X module is expected to be the first wafer fab to produce 14nm FinFET chips for Intel on 300mm diameter wafers. Back in October 2012 Intel said construction of D1X module 2 would begin in ...