Multiple members of the G450C -- an organization devoted to researching and commercializing 450mm wafer technology -- have declared their intent to exit the program. 450mm wafers have been on life ...

TSMC was planning on using 450mm wafers in 2015, according to some media reports. “The 450mm wafer has been pushed back quite a few times. There may have been an earlier schedule,” Kramer said.

As the semiconductor industry debates the merits and drawbacks of a possible future move to 450mm wafers, a movement has emerged to significantly enhance and extend the 300mm wafer size generation.

If a 450mm wafer packs 2.5x the processors of a 300mm wafer, the cost-per-processor is far lower if and only if Intel can ship every single chip. If it can't, then the cost structure inverts.

If you were looking forward to 450mm wafers, we’re sorry to say that the technology won’t be available anytime soon. The Global 450 Consortium, a massive $4.8 billion effort to bring about ...

Intel, Samsung, and TSMC will collaborate on 450mm silicon wafers; once chip companies have made the move, users should start to see higher-performing chips at lower prices Topics Spotlight: New ...

Intel, Samsung, TSMC to hold hands, jump to new wafer size Intel, Samsung, and TSMC have identified 2012 as the start date for what is … Jon Stokes – May 7, 2008 6:30 am | 0 ...

Spike annealing system to be used in development of 450mm semiconductor wafer manufacturing process. The semiconductor industry’s “Global 450-mm Consortium” (G450C) has selected US-based Ultratech’s ...

A necessary prerequisite for 450: The industry must first demonstrate that it can use a new lithography tool known as EUV (extreme ultraviolet).

The Intel fab — known as D1X module 2 — is intended to be a development fab for production of ICs on 450mm diameter wafers. However, the breaking of ground for the wafer fab was not widely reported at ...

Nikon has announced that the company will provide the Research Foundation for the State University of New York with a 450mm wafer ArF immersion scanner, with shipment scheduled in April 2015.

TSMC, the world's top contract chip maker, confirmed on Tuesday it is aiming to manufacture bigger silicon wafers that could lower the cost of chip production, but said technical difficulties will ...