Designing flexible electronics has long been constrained by the limits of two-dimensional printing. Now, researchers have ...

From spacecraft engineers to open-source rebels, these innovative women are changing the face of what engineering looks like, ...

The advanced semiconductor material gallium nitride will likely be key for the next generation of high-speed communication ...

AI requires a lot of data, particularly for training models. The problem is that planar chips are unable to process all that ...

A new terahertz technique reveals nanometer-scale PN junction depths in silicon chips, enabling faster, non-contact ...

Siemens and Samsung grow their cooperation with new solutions for power integrity, silicon photonics innovation, and analog ...

TE Connectivity’s Matt McAlonis discusses how engineers can use the “follow-the-wire” approach to enhance connectivity in ...

It was in a swimming pool that Massimo Caccia, an Italian physicist, first got the idea that would lead to what is now one of ...

A team of researchers from KAIST and Seoul National University has developed a groundbreaking electronic ink that enables room-temperature printing of ...

Explore why bonding methods in electronics are critical for performance, reliability, and innovation in today’s high-speed, compact devices.