Equipped with multimodal AI and a foldable-optimised UI, the Galaxy Z Fold7 delivers a truly Ultra experience that raises the ...

Intel Corporation's comeback depends on scaling Intel 18A to compete with TSMC and Samsung. Click for our updated look at ...

Star founders, Beijing officials and deep-pocketed financiers converge on Shanghai by the thousands this weekend to attend ...

TSMC may be exploring foundries for Chip-on-Wafer-on-Substrate (CoWoS) technology. This advanced packaging technology, developed by TSMC 3DFabric, is crucial for major tech companies seeking to boost ...

New Street Research upgraded ASML (AS:ASML) to Buy with a €790 price target in a note to clients on Thursday. The firm cited the company’s strong positioning for 2026 and potential to outperform peers ...

Facing high stakes, yet higher ambitions, Japan’s Rapidus presents the chip world with its first 2nm prototype chip. Will this big bet be able to compete with ...

Up to now, underwater navigation for divers has been limited primarily to orientation at distinctive points or compass navigation. Although there are concepts that, similar to a sonar, are intended to ...

Certain non-killer but marginal wafer defects can escape detection if they have sufficient electrical connectivity.

What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

Up to now, underwater navigation for divers has been limited primarily to orientation at distinctive points or compass ...