Arm CEO Rene Haas has revealed that the company is stepping up investment in chiplets and solutions development.

Rutronik expands franchise portfolio to include Axelera AI, European pioneer in the field of AI inference at the edge.

SiMa.ai, a developer of a MLSoC platform, has announced the next phase of its strategic collaboration with Synopsys.

European electronic components distribution market has yet to show any clear signs of recovery according to DMASS.

Skywater signs agreement with Infineon, giving it access to a library of silicon-proven, mixed-signal ASIC design IP.

With testing and prototyping timelines tightening, the company’s new Qualified Parts for Space (QPS) Universal Connector Saver (part number SQM-4733-MF-29M-02) now offers an easier path to sourcing ...

Renesas' 64-bit RZ/G3E MPU has been optimised for high-performance Human Machine Interface (HMI) applications.

Magnachip releases a 80V MXT MV MOSFET, the MDLT080N017RH, featuring a TOLT (TO-Leaded Top-Side Cooling) package.

Moxa Europe achieves EU type-examination certification under Radio Equipment Directive Delegated Act (RED-DA).

Tria Technologies, a SMARC (Smart Mobility ARChitecture) module vendor, said that its collaboration with Renesas meant that ...

The SEMI Silicon Manufacturers Group (SMG) has reported, in its quarterly analysis of the silicon wafer industry, that ...

Nexperia has introduced a new series of USB Type-C and USB power delivery (USB PD) controller ICs to support up to 18-140 W charging designs for the consumer USB charger market.