TSMC has announced that it will be establishing its first European Design Centre (EUDC) in Munich later this year.

TI's technologies will help enable NVIDIA’s 800V DC power-distribution systems for next-generation AI data centres.

SCI Semiconductor raises £2.5m towards developing its security-enhanced MCU based on CHERI, a memory securing framework.

The MLPF-WL-01D3/02D3/04D3 ICs combine impedance matching and harmonic filtering on a single glass substrate to optimise the ...

At last year’s IEDM, imec reported a breakthrough in the hetero-integration of InP chiplets on a 300mm RF Si interposer, at ...

CEO, Van den hove believes future chips will see their capabilities merged into building blocks called supercells.

Asahi Kasei, a top PSPI (photosensitive polyimide) supplier to TSMC and Samsung, plans to cut PIMEL shipments.

The European Union consortium PREVAIL, created to accelerate the development of next-generation edge-AI technologies, will ...

Eaton, the intelligent power management company, has announced the launch of the 9PX Gen2 5-11kW UPS - a new product that ...

Speedgoat has launched the latest addition to its portfolio of real-time target machines - the Pulse test system.

How AI, IoT connectivity and advanced interactive voice control systems are improving the smart home experience.

ROHM has expanded its portfolio of surface-mount near-infrared (NIR) LEDs with several new compact top-view types.