The global political and economic landscape is characterized by volatility; nevertheless, sources within the semiconductor ...

We recently published a list of Top 11 AI News and Ratings You Should Take a Look At. In this article, we are going to take a look at where Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM ...

Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.

TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims ...

Nvidia's high-priority Blackwell GPU models use TSMC's more advanced CoWoS-L technology. The discontinued B200A and the single-die B300 GPUs both use CoWoS-S. Due to these changes, certain ...

As Nvidia ramps up production of its multi-chiplet Blackwell-series products, the company will use more CoWoS-L packaging capacity and less CoWoS-S packaging capacity, the company's chief ...

and dual-die (CoWoS-L). Though Ming-Chi Kuo in the article claims these designations seem to be for marketing reasons, Nvidia refers to them as "Ultra dual-die" and "Ultra single-die" versions.

Nvidia's most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a complex chip on wafer on substrate (CoWoS) advanced packaging technology ...

The global political and economic landscape is characterized by volatility; nevertheless, sources within the semiconductor ...

Systems in the 300 Series include single-die (CoWoS-S) and dual-die (CoWoS-L). Though Ming-Chi Kuo in the article claims these designations seem to be for marketing reasons, Nvidia refers to them as ...