Design And Reuse

M31 Advances AIoT Innovation with Ultra Low Power Memory Compilers on TSMC N6e Platform

Hsinchu, Taiwan – September 25, 2025 – M31 Technology Corporation (M31), a leading silicon intellectual property (IP) provider, today announced its latest Ultra-Low Leakage (ULL), Extreme Low Leakage ...
Design And Reuse

Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design

Our longstanding relationship with TSMC underscores the transformative power of collaborative innovation,” said Mike Ellow, CEO, Siemens EDA, Siemens Digital Industries Software. “By combining Siemens ...
Design And Reuse

Cadence Partners with TSMC to Power Next-Generation Innovations Using AI Flows and IP for TSMC Advanced Nodes and 3DFabric

Cadence’s AI design flows support TSMC’s N2 and A16 ™ technologies; Cadence 3D-IC solutions provide comprehensive support for latest TSMC 3DFa ...
Design And Reuse

eMemory Recognized with 16th TSMC Open Innovation Platform® (OIP) Partner of the Year Award

Hsinchu, Taiwan, September 25, 2025-- eMemory, the world’s leading provider of embedded non-volatile memory (eNVM) and security IP, has been selected as the 2025 TSMC Open Innovation Platform ® (OIP) ...
Design And Reuse

Perceptia Introduces pPLL08N: A Family of Compact Narrow-Band RF PLLs which Complement pPLL08W

Sydney, Australia – September 25, 2025 – Perceptia Devices, a leader in low-jitter clocking IP, today announced the launch of its latest product, pPLL08N, a family of narrow-band RF phase-locked loops ...
Design And Reuse

Siemens adds AI to Simcenter Testlab to reinvent modal testing and analysis processes

Siemens consistently delivers on its commitment to leveraging AI to streamline processes and workflows, minimize manual tasks, and accelerate time to market throughout the engineering lifecycle. The ...
Design And Reuse

GUC Launches Next - Generation 2.5D/3D APT Platform Leveraging TSMC's Latest 3DFabric® and Advanced Process Technologies

The new platform builds on GUC’s first-generation 2.5D/3D APT platform introduced in 2022. Since then, GUC has closely collaborated with TSMC to incorporate major technological advancements of TSMC in ...
Design And Reuse

GlobalFoundries and Egis Partner to Develop Next-Generation Smart Sensing Technology for Mobile and IoT Applications

“Egis is proud to partner with GlobalFoundries to develop novel sensor solutions tailored for essential applications,” said Steve Lo, Chairman at Egis. “By leveraging GF’s advanced FSI SPAD technology ...
Design And Reuse

Arteris Selected by NanoXplore for Space Applications

NanoXplore addresses the needs of the aerospace, defense, avionics, and industrial markets with a comprehensive portfolio of high-performance components plus SoC and FPGA devices. The adoption of ...
Design And Reuse

MIPI A-PHY Reaches Milestone of First SerDes Standard to Enter Mass Production with Global Automotive OEM

MIPI contributor member company Velinktech recently announced that its high-speed automotive SerDes chipset has entered mass production in the 06 Relive compact SUV model by Lynk & Co, a global ...
Design And Reuse

Siemens accelerates complex semiconductor design and test with Tessent IJTAG Pro

Siemens Digital Industries Software announced today Tessent™ IJTAG Pro software, which will transform IJTAG (IEEE 1687) input/output by enabling parallel operations of the traditionally serial ...
Design And Reuse

EnSilica and Codasip announce strategic partnership

EnSilica and Codasip announce strategic partnership to bring CHERI cybersecurity to automotive, critical national infrastructure, defence and aerospace applicat ...