A new technical paper titled “What Is Next for LLMs? Next-Generation AI Computing Hardware Using Photonic Chips” was ...

A new technical paper titled “Enabling static random-access memory cell scaling with monolithic 3D integration of 2D ...

A technical paper titled “Enhancing Test Efficiency through Automated ATPG-Aware Lightweight Scan Instrumentation” was ...

A new technical paper titled “Power Consumption Optimization of GPU Server With Offline Reinforcement Learning” was published ...

A new technical paper titled “Josephson Junctions in the Age of Quantum Discovery” was published by researchers at Lawrence ...

Ansys divest requirements; SIA Factbook; McKinsey effects of tariffs; ASE's fan-out bridge; earnings; TSMC's design center; ...

Die cracking, solder joint fatigue, warpage, and delamination are just a few of the possible mechanical failures.

Problems and solutions for improving performance with more data. Demand for new and better AI models is creating an ...

Plan for multiple complementary verification methodologies for different levels of processor integration. With the explosive ...

In the past, simulation was the only tool available for verification, but today there are many. Balancing the costs and ...

How much value does DAC really add to the industry? Large EDA companies may be ignoring some of the benefits.

Quickly screen large amounts of possible materials for specific properties and select promising candidates for deeper ...