TSMC's first generation of SoW packaging involved mounting just the processing dies to the wafer, whereas the new version ...

The five components include: „X Shuttle-Lock™: The core component of ExpressConnect, it performs all wafer transfer functions. „X SEC-1000 Equipment Controller: A powerful, easily configured control ...

TSMC has already made a system-on-wafer for Tesla's Dojo supercomputer, but this version does not offer the kind of 3D-stacking with logic and memory the company has in mind for the next version ...

The 18 chamber, 300mm Ultra C VI tool is equipped with one highly efficient wafer transfer system that consists of multiple robots, which allows the tool to reach a maximum throughput of more than ...

RIBER secures a major order for an MBE 412 cluster system in Australia Bezons (France), May 13, 2025 – 8:00am (CET) – RIBER, the global leader for Molecular Beam Epitaxy (MBE) equipment for ...

Project WASP explores non-contact methods of measuring silicon wafers for the semiconductor industry. The team developed an automated wafer transfer system enclosed in a test bench and a measurement ...

The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family.

“As memory fabs come on-line with planned capacities of more than 100,000 wafer starts per month, a new PECVD market segment is emerging with unique system throughput requirements,” Tim Archer, senior ...

LOWELL, Mass., July 25, 2025 (GLOBE NEWSWIRE) -- (“MACOM”) (Nasdaq: MTSI), a leading supplier of semiconductor products, today announced it has assumed full operational control ...

The 18 chamber, 300mm Ultra C VI tool is equipped with one highly efficient wafer transfer system that consists of multiple robots, which allows the tool to reach a maximum throughput of more than ...