Defect detection requirements on the order of 10 defective parts per million (DPPM) are driving improvements in inspection ...

The wafer process control equipment market is being propelled by a combination of these factors, as the industry aims to increase production yields, enhance chip quality, and progress technologically.

This mystical process, known as transubstantiation, occurs after the priest consecrates the wafer, though no physical change in the bread and wine is visible.

TSMC's quote for a 300-mm wafer process using its N2 technology will exceed $30,000, according to the report. Previously it was expected that world's largest contract maker of chips will charge ...

MONITOR TWP, MI – The parent company of SK Siltron CSS is apparently in the process of selling a majority stake in the company to a private equity firm, according to publications that cover ...

Home > Computing TSMC Announces New System-on-Wafer Process With 3D-Stacking The company is combining two of its most ambitious technologies into an all-new design for future mega-chips.

Halo Industries, a California-based startup company with a novel, laser-based, method for producing silicon carbide (SiC) semiconductor wafer substrates, says it has raised $80 million in a series B ...

Typical 300mm wafers are progressively cut up via a process that includes laser scribing and mechanical cutting with diamond saw blades.