The so-called mainframe box, contains big power supplies ... The idea is you bolt the wafer probe card into the top of the machine, needles-down, then wheel the whole thing over to the ATE.

shape and flatness using MicroSense's patented non-contact auto-probe back pressure technology. The UltraMap 200-BP can determine a wide variety of wafer materials and wafer thicknesses. The surface ...

Dual configuration assures that errors introduced by the probe head manufacturer are eliminated, increasing the repeatability and accuracy of measurements. The Software controller automatically steps ...