The chucks developed and manufactured by Berliner Glas already have been made as resistant as possible to particle contamination by using a special pin or mesa design. The contact area between the ...

Their purpose is to fix a wafer, to straighten it, to keep it at a certain temperature and to release it quickly without damaging it or causing contamination. Clamping force and flatness are two ...

With these modes, the AC3 Fusion thermal chuck system is a no-compromise solution for energy-efficient and flexible tri-temperature wafer test. ERS's AC3 with patented air-management technology ...

To supply signals and power to the DUT, a metal-to-metal contact needs to be made between the DUTs pads/pin and interface hardware. For wafer test (sort or probe), this interface hardware is called a ...

As much as 200 kg must be withstood by the chuck holding the wafer and the structure supporting ... For example, the EG6000 prober features ±1.5-µm pin-to-pad accuracy. A proprietary grid ...

ERS's new "High Power Dissipation" System can dissipate wattage up to 2.5kW at -40°C on a 300 mm chuck, thereby allowing the testing of single dies as well as tests with full wafer contact.

In previous test infrastructures, a high site count was constrained by the available probe pins on the signal tower for wafer testing. However, the proposed signal tower addresses this bottleneck by ...