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Researchers have found a way to make the chip design and manufacturing process much easier — by tapping into a hybrid blend ...
Posted in Misc Hacks Tagged ic, machine, manufacturing, silicon, teardown, wafer transfer ← Demystifying Amateur Radio Callsigns The ESP: A New 1kB Contender Appears → ...
Chinese chipmaking tools vendor Kingsemi launched a new generation of its wafer coating and developing machine the FT (III) 300 on Dec. 17. The machine adopts a symmetrical design, with 36 spin ...
The In-Sight 1700 wafer reader, a compact machinevision sensor, combines ID software and image processing to identify and track semiconductor wafers through the manufacturing process. The unit can ...
Startup Cerebras Systems has unveiled the world’s largest microprocessor, a waferscale chip custom-built for machine learning. The 1.2 trillion transistor silicon wafer incorporates 400,000 cores, 18 ...
The ComPlus-EV from Applied performs high-speed wafer inspection for darkfield and brightfield applications for 90-nm production. Using its proprietary Enlarged GrayField technology, this ...
Since its launch in 2006, MHI has expanded its room-temperature bonding machine portfolio steadily, including a 200 millimeters (8-inch) wafer bonding machine introduced earlier for 3-D integrated LSI ...
Advanced machine learning is beginning to make inroads into yield enhancement methodology as fabs and equipment makers seek to identify defectivity patterns in wafer images with greater accuracy and ...
Overtaking ASML won’t be easy. At stake is control of the machine that will shape the future of computing, AI and technology itself. ASML ’s most advanced machine is mind-boggling.
In a two-step process, silicon nanowires suspended in a drop of water are deposited on a special staging wafer patterned with a grid of tiny posts, and dried. Resting on the tops of the posts ...