[BrendaEM] walks us through a teardown of a machine that was designed under just ... metal post” as an interrupt solution for the wafer. However, we’re glad she did. The machine features ...

Yet unlike software, where industry leadership can shift in a matter of months, success in lithography is a slow-moving race ...

Chip binning' is supposed to be the process of testing newly manufactured silicon to see how many of the important bits work and how high the thing will clock. But TSMC seems to be taking the notion a ...

where she familiarized herself with the EUV machine’s parts: the scanner (the part with the mirrors that focus the light onto the wafer), the source (the part that generates the light ...

And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

User defined and ASTM/SEMI scan patterns are used to generate a full 3-dimensional image of the wafer. Easy to Use.... The standard Windows® user interface makes the Proforma 300SA easy to use and set ...

High-precision Laser Wafer Marking technologies are designed ... product transport and handling, machine vision, and fume extraction. Engineers can tailor the process to accommodate virtually ...

Then you will need a special wire cutter. Not wirecutter - a wire cutter, that is a machine with a thin wire that cuts wafer into chips and minimizes dust. After that, you need an assembly machine ...