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We recently published a list of 11 AI News Updates Investors Should Not Miss. In this article, we are going to take a look at ...

Knowing where circuits came from, and the conditions in which they operate, can help designers optimize devices already in ...

However, not all chips perform equally, even if they come from the same wafer. This is where chip binning comes in. After dicing, each die is tested and sorted based on factors like speed ...

Wafer-scale LLM chips are reshaping AI with massive parallelism, outperforming GPUs in speed, efficiency, and scalability.

During the gradual move from 28nm down to 3nm, Apple’s die size hasn’t grown much ... Apple may be paying per chip, rather than wafer, which would likely work in Apple’s favor.

The aptly monikered Redditor, AVX512-VNNI, says the wafer, which appears to be fully intact, was found discarded at TSMC's Fab 16 chip factory or fab in Nanjing, China. While it's not the most ...