The wave guides need a much higher level of control of the silicon ... These include <100nm alignment accuracy, new levels of cleanliness in chip-to-wafer bonding and singulation tools, exceptional ...

Imec, Brewer Science, and Suss MicroTec recently demonstrated that collective die-to-wafer bonding flows can be extended to three and four wafers. [1] A so-called acoustic layer was added to the ...

Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform includes a newly designed high-force bond chamber that ensures excellent ...

Imec and EVG have demonstrated 1.8µm pitch overlay accuracy for wafer-to-wafer bonding. Wafer-to-wafer bonding is a promising technique for enabling high-density integration of future ICs through 3D ...

Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...

Jan. 23, 2025 /CNW/ -- Ortel, a Photonics Foundries enterprise, today announced the successful transfer of wafer fabrication for its C-Band, High-Power, Continuous Wave Laser Module platform to ...

Semiconductor research lab Imec has demonstrated wafer-bonding with 400nm pitch copper conductors across the boundary, proposing the technology for logic-on-logic and memory-on-logic wafer stacking ...

DXB bonding chamber is available in two sizes: 11 inches (279 mm) and 5.2 inches (132 mm).The DXB can be used for single or multiple wafer bonding. For example, four four inch wafer can be bonded at ...

Pressurex® film from Sensor Products Inc. is a way to detect and correct pressure variations which can result in flaws (defects) in the wafer bonding process. When placed between contacting surfaces, ...

The EV Group (EVG), a provider of process solutions for semiconductor designs and chip integration schemes, has unveiled the next-generation version of its GEMINI automated production wafer bonding ...