Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...

Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform includes a newly designed high-force bond chamber that ensures excellent ...

The SB6/8e system features a rigid vacuum chamber for best-in-class post-bond alignment accuracy, independent upper and lower substrate heaters and precise programmable force control during the wafer ...