The temporary bonding and debonding equipment uses a hybrid laser debonding solution with an industry-leading throughput of over 60 to 100 wafers per hour. It also supports wafer thinning to less than ...

Contacts. Investor Relations Contact: Headgate Partners LLC Claire McAdams, 530-265-9899 Fax: 530-265-9699 claire@headgatepartners.com or Company Contact: Nanometrics Incorporated Kevin Heidrich ...

In this work, wet and semidry transfer (i.e. wafer bonding) are evaluated regarding wafer scalability, handling, potential for automation, yield, contamination and electrical performance. A wafer ...

The semi-automated SB6/8 Gen2 is SUSS MicroTec's state of the art universal permanent wafer bonding system that handles wafers up to 200 mm and supports various substrate types and sizes.

At the same time, the SEMATECH team has explored unique 3D metrology and failure analysis techniques to complement bonding tool development. These results are key steps towards bridging high ...

A new technical paper titled “Material-Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, TEL, SK hynix, and University of ...

The companies said they will utilize their respective expertise to develop low-temperature wafer bonding equipment and processes. EVG said it brings its 15-years of experience in low temperature and ...

Valuates Reports Logo. The Temporary Wafer Bonding Materials Market was estimated to be worth USD 269.58 Million in 2024 and is forecast to a readjusted size of USD 400.17 Million by 2031 with a ...

PLAINVIEW, N.Y., April 28, 2025 (GLOBE NEWSWIRE) -- Veeco Instruments Inc. (NASDAQ: VECO) announced today two leading-edge logic customers have selected Veeco’s Laser Spike Annealing Platform as ...