Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...

Wafer bowing causes measurement errors as the wafer is scanned. A unique custom self-calibration tool and algorithm finds very small angular errors in the cameras and the machine uses this information ...

Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform includes a newly designed high-force bond chamber that ensures excellent ...