However, producing working diamond chips requires large and very thin wafers, similar to the thin silicon wafers used to build modern computer chips, which have proved tricky to create.

Thin wafers also play a pivotal role in assembling fan-out wafer ... “The introduction of through-silicon vias in many current applications requires a very controlled thinning process, and because you ...

Wafers prepared for hybrid bonding must meet critical process ... we clean the wafer front side and the back side at the same time,” said Henry. “So for some of these very thin applications, ...