From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

Read more Google says its AI designs chips better than humans – experts disagree However, producing working diamond chips requires large and very thin wafers, similar to the thin silicon wafers ...

Scientists from the Korea Institute of Energy Research (KIER) and Chungbuk National University (CBNU) have developed a new manufacturing process for ultra-thin silicon wafers. They claim their new ...