It relies on a pair of tiny prisms to bounce light under one side of a BGA chip and back up the other. The prisms are made from thin sheets of acrylic; [Petteri] didn’t have any 1-mm acrylic ...

The temperature is controlled via USB by a computer, allowing [Edmar] to set a temperature profile as recommended by the BGA chip’s data sheet. Right now, removing a BGA chip works great ...

Measuring just 9×13mm in dimension, it is an incredibly compact UFS 4.0 chip. The semiconductor company is currently sampling the new solution. Micron promises faster AI performance with its ...

San Jose, California - November 5, 2012 - Arasan Chip Systems, Inc. ("Arasan"), a leading provider of Total IP Solutions, announced today it has strengthened its leading position in the UFS market ...

US-based memory chipmaker Micron Technology commenced sample shipments of a Universal Flash Storage (UFS) 4.0 chip expected to appear in flagship smartphones and other devices later this year. Chris ...

Dublin, March 18, 2024 (GLOBE NEWSWIRE) -- The "Global Automotive Memory Chip and Storage Industry Report ... stored in the hard disk (i.e., eMMC or UFS). NAND generally stores continuous data ...

South Korean tech giant Samsung Electronics has initiated the mass production of UFS 3.1 storage chips for automotive applications, specifically targeting in-vehicle infotainment (IVI) systems.

It was also an odd choice by Google to use the slower eMMC 5.1 NAND on the Pixel 3a since almost all mid-range smartphones launched in 2019 made use of the faster UFS 2.1 storage chip. Thankfully ...

Now it appears this chip will indeed be a big one, as newly unearthed details show it will use a BGA package that is 70% larger than the one required by existing Phoenix and Strix mobile CPUs.

Greenliant has recently announced the release of its NVMe NANDrive BGA SSDs, a new line of solid-state drives designed to endure the harshest environments while delivering exceptional performance.