For future generations of 10- to 12-V power MOSFETs, the new ultra-thin power wafers enable up to 40% less on-resistance (R DS(on)) than traditional silicon wafers. Thus, they can handle higher ...

Markets calling for ultrathin wafers are growing. The combined thickness of an HBM module with 12 DRAM dies and a base logic chip is still less than that of a prime silicon wafer. Thin wafers also ...

“Infineon’s breakthrough in ultra-thin wafer technology marks a significant step ... The company will present the new silicon power wafers to the public at the Electronica trade show, taking place in ...

A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has ...

With a thickness of only 20 µm and a diameter of 300 mm, Infineon’s silicon power wafers are the thinnest in the industry. These ultra-thin wafers are a quarter the thickness of a human hair and half ...

The silicon wafers are a quarter as thick as a human hair and half as ... Here voltages have to be reduced from 230 V to a processor voltage below 1.8 V. The ultra-thin wafer technology boosts the ...

An international research team has sought to apply black silicon (bSi) to develop ultra-thin substrates for applications ... of ultrathin and flexible wafers with lower impurity levels, which ...

Scientists uncovered rare hexagonal silicon forms (2H, 4H, 6H) created by stress and heat, challenging assumptions about this ...

By the end of 2022, it achieved successfully development and mass production of ultra-thin silicon wafers, zero busbar technology, low-silver metallization paste, and Hyper-link cell ...