For future generations of 10- to 12-V power MOSFETs, the new ultra-thin power wafers enable up to 40% less on-resistance (R DS(on)) than traditional silicon wafers. Thus, they can handle higher ...

Enter 2D materials—delicate, two-dimensional sheets of perfect crystals that are as thin as a single atom ... the materials on industry-standard silicon wafers while preserving their perfect ...

The silicon wafers are a quarter as thick as a human hair and half as ... Here voltages have to be reduced from 230 V to a processor voltage below 1.8 V. The ultra-thin wafer technology boosts the ...

Markets calling for ultrathin wafers are growing. The combined thickness of an HBM module with 12 DRAM dies and a base logic chip is still less than that of a prime silicon wafer. Thin wafers also ...

An international research team has sought to apply black silicon (bSi) to develop ultra-thin substrates for applications ... of ultrathin and flexible wafers with lower impurity levels, which ...

Infineon has reached a breakthrough in handling and processing the thinnest silicon power wafers ever manufactured, with a thickness of only 20 micrometers and a diameter of 300 millimeters, in a high ...

With a thickness of only 20 µm and a diameter of 300 mm, Infineon’s silicon power wafers are the thinnest in the industry. These ultra-thin wafers are a quarter the thickness of a human hair and half ...

By the end of 2022, it achieved successfully development and mass production of ultra-thin silicon wafers, zero busbar technology, low-silver metallization paste, and Hyper-link cell ...

A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has ...